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Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/3842

Title: THE INFLUENCE OF CURRENT STRESS ON THE AGING OF AU-ALL-PERCENT-SI(1-PERCENT-CU) BALL-BOND CONTACTS STUDIED BY SEM AND EDX
Authors: D'OLIESLAEGER, Marc
DE SCHEPPER, Luc
DE CEUNINCK, Ward
STALS, Lambert
Issue Date: 1992
Publisher: ELSEVIER SCIENCE BV
Citation: MICROELECTRONIC ENGINEERING, 19(1-4). p. 579-584
Abstract: SEM/EDX investigations on top-view and cross-sectional ball-bond samples show that an applied current stress influences the ageing characteristics of Al-Au ball-bond contacts. It is found that the direction of the applied current stress is affecting the formation of the Al-Au intermetallics. Two types of metallization layers are investigated: Al1%Si and Al1%Si1%Cu.
Notes: DOLIESLAEGER, M, LIMBURGS UNIV CENTRUM,INST MAT RES,DIV MAT PHYS,B-3590 DIEPENBEEK,BELGIUM.
URI: http://hdl.handle.net/1942/3842
DOI: 10.1016/0167-9317(92)90501-H
ISI #: A1992KA73100121
ISSN: 0167-9317
Type: Journal Contribution
Appears in Collections: Research publications

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