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Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/3812

Title: ELECTROMIGRATION - INVESTIGATION OF HETEROGENEOUS SYSTEMS
Authors: VANHECKE, B
DE SCHEPPER, Luc
DE CEUNINCK, Ward
DHAEGER, V
D'OLIESLAEGER, Marc
BEYNE, E
ROGGEN, J
STALS, Lambert
Issue Date: 1993
Publisher: PERGAMON-ELSEVIER SCIENCE LTD
Citation: MICROELECTRONICS AND RELIABILITY, 33(8). p. 1141-1157
Abstract: Electromigration is a phenomenon where atoms am driven from their lattice positions due to an electric current. In general two types of electromigration systems can be distinguished: the heterogeneous system, in which electromigration failure occurs at the interface of two distinct parts on the interconnection while in the second, homogeneous case the failure occurs within the interconnection itself. The first type of electromigration is reported in this study and off-chip gold ball bonds on aluminium metallization are used as an example. In-situ electrical measurements of the resistance change as a function of time with different temperature and current stresses are performed. A good understanding of the kinetics of the resistance change could be obtained which helps in the characterisation of the processes active during the degradation of the interconnections.
Notes: LIMBURGS UNIV CENTRUM,INST MAT RES,DIV MAT PHYS,B-3590 DIEPENBEEK,BELGIUM.VANHECKE, B, IMEC VZW,DIV MAT & PACKAGING,KAPELDREEF 75,B-3001 LOUVAIN,BELGIUM.
URI: http://hdl.handle.net/1942/3812
ISI #: A1993LH30000013
ISSN: 0026-2714
Type: Journal Contribution
Appears in Collections: Research publications

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