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Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/3165

Title: Study of Cu diffusion in an Al-1 wt%Si-0.5 wt%Cu bond pad with an Al-1 wt%Si bond wire attached using scanning electron microscopy
Authors: COSEMANS, Patrick
D'HAEN, Jan
Witvrouw, A
Proost, J
D'OLIESLAEGER, Marc
DE CEUNINCK, Ward
Maex, K
DE SCHEPPER, Luc
Issue Date: 1998
Publisher: PERGAMON-ELSEVIER SCIENCE LTD
Citation: MICROELECTRONICS RELIABILITY, 38(3). p. 309-315
Abstract: A study with scanning electron microscopy (SEM) and scanning transmission electron microscopy (STEM) of the Al-l wt.%Si-0.5 wt.%Cu bond pad metallisation with Al-l wt.%Si wires bonded to it revealed Cu diffusion from the bond pad into the Al wire after an annealing process. investigation at different annealing times showed a Cu depletion zone which indicates that the radius R is consistent with a root t behaviour. The diffusion velocity, as determined experimentally, is close to the velocity of grain boundary diffusion. This observation has important consequences with respect to electromigration testing of Ai(Si)Cu metallisations bonded with Al wires. The electromigration (EM) process can be influenced by a bad placement of the Al bond wire with regard to the test lines. If bonded too close to the test line, Cu diffusion out of the test line is possible during annealing, thereby changing the microstructure locally and thus the EM process. (C) 1998 Elsevier Science Ltd. All rights reserved.
Notes: Limburgs Univ Ctr, Inst Mat Res, Div Mat Phys, B-3590 Diepenbeek, Belgium. IMEC, B-3001 Leuven, Belgium.De Schepper, L, Limburgs Univ Ctr, Inst Mat Res, Div Mat Phys, Univ Campus,Wetenschapspk 1, B-3590 Diepenbeek, Belgium.
URI: http://hdl.handle.net/1942/3165
DOI: 10.1016/S0026-2714(97)00051-6
ISI #: 000073266400002
ISSN: 0026-2714
Type: Journal Contribution
Validation: ecoom, 1999
Appears in Collections: Research publications

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