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Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/2966

Title: Dynamics of electromigration induced void/hillock growth and precipitation/dissolution of addition elements studied by in-situ scanning electron microscopy resistance measurements
Authors: D'HAEN, Jan
COSEMANS, Patrick Peter
MANCA, Jean
LEKENS, Geert
MARTENS, Tom
DE CEUNINCK, Ward
D'OLIESLAEGER, Marc
DE SCHEPPER, Luc
Maex, K
Issue Date: 1999
Publisher: PERGAMON-ELSEVIER SCIENCE LTD
Citation: MICROELECTRONICS RELIABILITY, 39(11). p. 1617-1630
Abstract: In the present paper. it has been shown that the in-situ SEM resistance measurement technique is a powerful technique to study the dynamics of void/hillock growth and precipitation/dissolution of addition elements in a metal line submitted to a temperature/current stress. The power of the in-situ SEM resistance measurement technique is shown with the first results on Al1wt.%Si0.5wt.%Cu metal lines. During the electromigration experiment, performed in a SEM equipped with a heating stage, back scattered electron images are taken continuously over the entire length of the metal line monitoring a.o. the growth, shape variation and motion of voids/hillocks, The dissolution and motion of Al2Cu precipitates in the Al1wt.%Si0.5wt.%Cu metal lines can also be monitored since the precipitates appear in the BSE mode as white objects. By comparing the observed electrical resistance drift results with the corresponding SEM micrographs it can be concluded that the resistance changes in the current stressed metal lines are mainly induced by geometrical changes. (C) 1999 Elsevier Science Ltd. All rights reserved.
Notes: Limburgs Univ Ctr, Inst Mat Res, IMO, B-3590 Diepenbeek, Belgium. Katholieke Univ Leuven, B-3001 Heverlee, Belgium. IMEC, B-3001 Heverlee, Belgium.D'Haen, J, Limburgs Univ Ctr, Inst Mat Res, IMO, Wetenschapspk, B-3590 Diepenbeek, Belgium.
URI: http://hdl.handle.net/1942/2966
DOI: 10.1016/S0026-2714(99)00169-9
ISI #: 000084305000011
ISSN: 0026-2714
Type: Journal Contribution
Validation: ecoom, 2001
Appears in Collections: Research publications

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