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Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/26698

Title: Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modules
Authors: Nivelle, Philippe
Borgers, Tom
Voroshazi, Eszter
Poortmans, Jef
D`Haen, Jan
De Ceuninck, Ward
Daenen, Michaël
Issue Date: 2018
Citation: 2018 IEEE International Reliability Physics Symposium (IRPS), Burlingame - California, USA, 11-15/03/2018
Abstract: In this work, new insights on adhesion of encapsulants to various photovoltaic related surfaces are gained. The effect of flux on the adhesion strength of encapsulant is also studied. A relation between surface roughness and adhesion strengh is exposed.
URI: http://hdl.handle.net/1942/26698
Category: C2
Type: Conference Material
Appears in Collections: Research publications

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