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Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/25160

Title: Ultrasonic bonding of aluminium ribbons to molybdenum back contacted CIGS modules
Authors: Basher, Hassan
Carolus, Jorne
Gevaerts, Veronique
Meuris, Marc
Daenen, Michaël
Issue Date: 2017
Citation: 9th edition Sunday 2017, Bussum - The Netherlands, 8/10/2017
Abstract: The connection of the output terminals of thin film photovoltaic (TFPV) modules with a molybdenum (Mo) back contact is challenging because of the molybdenum diselenide (MoSe2) layer which is formed during the selenization process. MoSe2 is known to be highly resistive and previous research showed that high temperature soldering is not favourable for CIGS. In this work, we present the possibilities of ultrasonic bonding in order to create a low resistive and reliable connection of the output terminals.
URI: http://hdl.handle.net/1942/25160
Category: C2
Type: Conference Material
Appears in Collections: Research publications

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