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Please use this identifier to cite or link to this item: http://hdl.handle.net/1942/1484

Title: Influence of grain orientation on the microstructural characterization in cu during (self)-anneal using a surface acoustic wave technique
Authors: Sekiguchi, K.
VANSTREELS, Kris
Demuynck, S.
D'HAEN, Jan
Brongersma, S.
Issue Date: 2006
Publisher: MATERIALS RESEARCH SOCIETY
Citation: Tsui, TY & Joo, YC & Michaelson, L & Lane, M & Volinsky, AA (Ed.) MATERIALS, TECHNOLOGY AND RELIABILITY OF LOW-K DIELECTRICS AND COPPER INTERCONNECTS. p. 129-134.
Series/Report: MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS, 914
Abstract: This paper describes the influence of microstructure, or more specifically grain orientation and grain size, on the in-line monitoring of copper interconnect properties during (self)-anneal using surface acoustic wave spectroscopy (SAWS). In electroplated Cu after (sell)anneal the SAWS frequency is lower for samples annealed at higher temperature because of the lower porosity induced elasticity. In sputtered Cu, the SAWS frequency shows a clear correlation with grain size, which is induced by a strong re-orientation of the copper film from the as-deposited (111) texture. (E=190 GPa) to a strongly (100) textured super grain structure (E=78GPa).
URI: http://hdl.handle.net/1942/1484
ISI #: 000242213700019
ISSN: 0272-9172
Category: C1
Type: Proceedings Paper
Appears in Collections: Research publications

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